1. 2. 3. material content data sheet sales product name bsc082n10ls g issued 19. february 2015 ma# MA001337748 package pg-tdson-8-1 weight* 122.78 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 5.418 4.41 4.41 44126 44126 leadframe non noble metal iron 7439-89-6 0.038 0.03 308 inorganic material phosphorus 7723-14-0 0.011 0.01 92 non noble metal copper 7440-50-8 37.762 30.76 30.80 307565 307965 encapsulation organic material carbon black 1333-86-4 0.078 0.06 634 plastics epoxy resin - 5.529 4.50 45032 inorganic material silicondioxide 60676-86-0 33.329 27.15 31.71 271458 317124 leadfinish non noble metal tin 7440-31-5 1.452 1.18 1.18 11824 11824 plating noble metal silver 7440-22-4 0.166 0.13 0.13 1348 1348 solder noble metal silver 7440-22-4 0.101 0.08 825 non noble metal tin 7440-31-5 0.081 0.07 660 non noble metal lead 7439-92-1 3.868 3.15 3.30 31505 32990 clip plating noble metal silver 7440-22-4 1.289 1.05 1.05 10502 10502 heatspreader non noble metal iron 7439-89-6 0.011 0.01 92 inorganic material phosphorus 7723-14-0 0.003 0.00 28 non noble metal copper 7440-50-8 11.320 9.22 9.23 92201 92321 heat sink clip non noble metal iron 7439-89-6 0.022 0.02 182 inorganic material phosphorus 7723-14-0 0.007 0.01 55 non noble metal copper 7440-50-8 22.292 18.16 18.19 181563 181800 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and contains pb according rohs exemption 7a, lead in high melting temperature type solders. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
